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职位描述/要求:
General Requirements: 1.Bachelor degree in Applied Electronic/Material/Mechanics/IT Engineering. 2.Prefer have3 years experience on semiconductor related and assembly especially Die Attach 、wire Bond 3.Good team work spirit,stability,well communication skill,high responsibility. 4.Good skills in both written and spoken English.
Responsibilities: 1.Focus on process relate,yield improve,quality issue treatment,data analysis and summary ,report,specification documentation, machine transfer and qualification,cost down,operator sign off,engineering sample build and new technology transfer. 2.Engineering seminar and training arrangements. 3.Communicate well to appropriate people on any action item and follow up till 100% completion.
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